High-Quality Lead-Free BGA Flux Paste – Recommended for Mobile Phone Repair & General Rework

High-Quality Lead-Free BGA Flux Paste – Recommended for Mobile Phone Repair & General Rework Description This product is a lead-free, environmentally friendly flux paste designed to assist soldering in mobile phone repair and BGA rework. It improves solder wettability, enhances flow, and helps hold components in place during soldering. The paste is compatible with common PCB repair applications and is suitable for technicians working on fine-pitch components, BGA balls, and reballing processes. Features * Lead-free, environmentally friendly flux formulation * Promotes better solder wetting and flow * Helps secure components during soldering * Suitable for BGA rework, mobile phone motherboard repair, and fine-pitch assembly * Reduces oxidation and improves soldering quality Specifications Product name: BGA Flux Paste Model: KNY-559 Brand: KANOYU Net weight: 100 g Type: Lead-free flux paste (non-metallic) Color: Translucent Application: Mobile phone repair, BGA rework, PCB soldering assistant Usage Instructions Use appropriate amount on soldering surface, heat with soldering iron or hot air to activate flux, then perform soldering. Clean after soldering if necessary.     نعتذر الشراء من الموقع متوقف مؤقتا     We apologize : purchasing from our website is temporarily stopped